Foxconn has partnered with French companies Thales and Radiall to invest around €250 million (approximately NT$8.5 billion) to build Europe's first fan-out wafer-level packaging (FOWLP) advanced packaging and testing factory. Franck Paris, Director of the French Office in Taipei, stated on May 20, "This is not just a venture for Foxconn; it could also drive other Taiwanese supply chains into Europe."

This investment marks Taiwan's second-largest direct investment in France, following the establishment of the solid-state battery plant by ProLogium in northern France in 2023. Paris highlighted that Foxconn's operations not only fill the gap in advanced packaging in Europe’s semiconductor production but also represent a key entry of Taiwanese companies into the European chip supply chain with core technology.

Foxconn's investment focuses on four major application areas: automotive chips, space technology, 6G mobile communication, and defense industries. The new factory aims to produce over 100 million system-in-package (SiP) components annually by 2031, serving the entire European market with France as its base.

Choosing France over other European countries is due to the French emphasis on the technological capabilities of Taiwanese enterprises, while Taiwanese companies are focused on France's advantages in space and defense sectors. The collaboration between Foxconn and Thales expands beyond semiconductor packaging; they will also initiate strategic cooperation on low-orbit satellite production technology, following the successful launch of Foxconn’s self-developed satellite "Pearl" in November 2023.

Paris noted that Thales is a leader in Europe's space industry and participates in the European Starlink project, and this cooperation aligns with the French national strategy prioritizing innovation in the space sector. He believes this is an important milestone for Foxconn to enter a high-value international supply chain.

The joint venture was officially announced during this week's "Choose France" summit, an annual foreign investment promotion platform founded by President Macron in 2018, with over 200 global business leaders participating this year. Foxconn is among the most prominent Asian businesses showcased at the event. Paris stated, "This investment not only elevates Taiwan-France economic cooperation but also lays the foundation for a more complete chip supply chain in Europe."

Additionally, Paris highlighted the competitive landscape for global investments. He pointed out that the Trump administration's tariff policies aimed at attracting companies to invest in the U.S. remain a challenge for many countries. The Biden administration has continued this trend through subsidy policies aimed at encouraging foreign investment in U.S. factories, leading to intensified competition in global investment.